DIP Manufacturing Process and Capability

DIP Manuafacturing Process: The abbreviation for Dual In Line Package Process, DIP is a dual-line packing for component installation. It is an integration of traditional electronic component and PCB processing. Modern electronic products are expected to be lightweight, slim and compact, and hence most DIP components have been replaced by SMD. DIP soldering is different from SMT process. Briefly, this is a technology where components are manually inserted into PCB holes (PTH), and using Flux sprayer, an appropriate amount of flux is sprayed onto the back of the PCB. Then after preheating and dipping in the tin furnace, the liquid tin adheres to the component pins and PCB holes to attach the electronic components to the PCB-PAD, thereby completing the assembly and mounting process, which is briefly referred to as DIP manufacturing process.

Taiwan Luen Huei Electronics Co. Ltd has three insertion, touch-up, and hand soldering lines and non-lead furnace DIP production lines, and together with devices such as thermostat soldering pens, dispensers and DIP AOI , up to L510mm*W650mm sized PCB can be produced.