SMT manufacturing process and capability

SMT Manufacturing Process: The abbreviation for Surface Mount Technology, SMT is a surface mounting technology. This electronic assembly technology originated in the 1960s, and was initially developed by the U.S. IBM, and further matured during the late 1980s. Through this technology, electronic components such as resistors, capacitors, transistors and integrated circuits are mounted on printed circuit boards and lead soldered to form electric coupling. Components used in this process are called SMD (surface-mount devices). The greatest difference between SMT and through-hole technology is that SMT does not require corresponding holes to be reserved for component pins, and hence the sizes of SMD are much smaller than the sizes of components used in through-hole technology. This SMT technology for greatly reducing the size of electronic products and creating lightweight and slim products is brieflyreferred to as the SMT process. Taiwan Luen Huei Electronics Co. Ltd has a long-standing cooperation with domestic and foreign electronic products manufacturers. Its accumulated wealth of professional experience in SMT OEM has repeatedly won excellent domestic and international evaluation and recognition in the SMT OEM industry for electronics manufacturing.

Taiwan Luen Huei Electronics Co. Ltd has four fully automatic high-speed Panasonic equipment nitrogen furnace SMT production line that can produce a daily maximum of 5, K, K point components.

Minimum: 01005 chip component; maximum: L150mm*W55mm*T25mm 

Board size: minimum L50mm*W50mm~maximum L750mm*W550mm

Auxiliary Production equipment